
Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it beco ...
DETAILS
Force Sensors for Microelectronic Packaging Applications
Schwizer, Jürg, Mayer, Michael, Brand, Oliver
Kartoniert, viii, 178 S.
VIII, 178 p.
Sprache: Englisch
235 mm
ISBN-13: 978-3-642-06063-2
Titelnr.: 28207941
Gewicht: 295 g
Springer, Berlin (2010)
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